Publicou 18 edições por ano
ISSN Imprimir: 1064-2285
ISSN On-line: 2162-6561
Indexed in
EXPERIMENTAL AND ANALYTICAL INVESTIGATION OF THERMAL MANAGEMENT OF LED ASSEMBLIES USING MICRO-HEAT COOLING DEVICES
RESUMO
This work considers the high-brightness LEDs using micro-heat pipe devices for enhancing the thermal management of LEDs' light assemblies. A micro-heat cooling device using a radial micro-screw pipe is experimentally studied, and a heat transfer model using a finite element method is numerically analyzed. The cooling performance of radial micro-screw pipe device that use air cooling, water cooling, and cycling water was evaluated and compared by measuring the LED case temperature. The results show that the micro-screw pipe system can achieve better thermal management and the heat created by the LEDs is effectively dissipated in the high-brightness LED assemblies. Moreover, the use of FEM gives a satisfactory result for predicting heat distribution in LED chip systems with micro-screw pipe devices. It is experimentally demonstrated that the micro-screw pipes with water-cooling systems provide very effective thermal management of the high-brightness LED assemblies. They also increase the reliability and life of LEDs.
-
Chen, H.T., Lu, Y., and Gao, Y.L., The Performance of Compact Thermal Models for LED Package, Thermochim. Acta, vol. 488, pp. 33-38, 2009.
-
Garcia, J., Dalla-Costa, M.A., Cardesin, J., Alonso, J.M., and Rico-Secades, M., Dimming of High-Brightness LEDs by Means of Luminous Flux Thermal Estimation, IEEE Trans. Power Electron., vol. 24, no. 4, pp. 1107-1114, 2009.
-
Ha, M. and Graham, S., Development of a Thermal Resistance Model for Chip-on-Board Packaging of High Power LED Arrays, Microelectron. Reliab., vol. 52, pp. 836-844, 2012.
-
Jang, D., Park, S.-J., and Lee, K.-S., Thermal Performance of a PCB Channel Heat Sink for LED Light Bulbs, Int. J. Heat Mass Transf, vol. 89, pp. 1290-1296, 2015.
-
Jeng, T.-M., Tzeng, S.-C., and Lin, Y.-C., Experimental Study of Heat Transfer Enhancement of Inserted Led Lamp by the Closed-Cell Aluminum-Foam Ceiling, Int. Commun. Heat Mass Transf., vol. 66, pp. 233-239, 2015.
-
Jeong, M.W., Jeon, S.W., Lee, S.H., and Kim, Y., Effective Heat Dissipation and Geometric Optimization in an Led Module with Aluminum Nitride (AlN) Insulation Plate, Appl. Therm. Eng, vol. 76, pp. 212-219, 2015.
-
Jung, E.D. and Lee, Y.L., Development of a Heat Dissipating LED Headlamp with Silicone Lens to Replace Halogen Bulbs in Used Cars, Appl. Therm. Eng., vol. 86, pp. 143-150, 2015.
-
Kim, Y.P., Kim, Y.S., and Ko, S.C., Thermal Characteristics and Fabrication of Silicon Sub-Mount Based LED Package, Micro-electron. Reliab., vol. 56, pp. 53-60, 2016.
-
King, S.Y., Tseng, J., and Zhao, J., Design of AlN-Based Micro-Channel Heat Sink in Direct Bond Copper for Power Electronics Packaging, Appl. Therm.Eng., vol. 52, pp. 120-129, 2013.
-
Lee, Z.-Y. and Devarajan, M., Thermal Transient Evaluation and Optical Characterization of Packaged Light-Emitting Diodes, Heat Mass Transf., vol. 50, pp. 787-793, 2014.
-
Liu, X., Wan, Z., Chen, M., and Liu, J., Research on Porous Micro Heat Sink for Heat Dissipation of High Power LEDs, Proc. of Asia-Pac. Power and Energy Eng. Conf. (APPEEC 2010), Chengdu, pp. 1-4, 2010.
-
Liu, S., Yang, J., Gan, Z., and Luo, X., Structural Optimization of a Microjet based Cooling System for High Power LEDs, Int. J. Therm. Sci., vol. 47, pp. 1086-1095, 2008.
-
Narendran, N. and Gu, Y.M., Life of LED-Based White Light Sources, J. Disp. Technol., vol. 1, no. 1, pp. 167-171, 2005.
-
Ozdemir, A.E., Koysal, Y., Ozbas, E., and Atalay, T., The Experimental Design of Solar Heating Thermoelectric Generator with Wind Cooling Chimney, Energy Convers. Manage., vol. 98, pp. 127-133, 2015.
-
Principi, P. and Fioretti, R., A Comparative Life Cycle Assessment of Luminaires for General Lighting for the Office-Compact Fluorescent (CFL) vs Light Emitting Diode (LED)-A Case Study, J. Clean Prod., vol. 83, pp. 96-107, 2014.
-
Sheen, M.T., D. Jean, M., and T. Lai, Y., Application of Micro-Tube Water-Cooling Device for the Improvement of Heat Management in Mixed White Light Emitting Diode Modules, Adv. Mater. Res., vols. 308-310, pp. 2422-2427, 2011.
-
Wan, Z.M., Liu, J., Su, K.L., Hu, X.H., and M, S.S., Flow and Heat Transfer in Porous Micro Heat Sink for Thermal Management of High Power LEDs, Microelectron. J., vol. 42, no. 5, pp. 632-637, 2011.
-
Wang, J., Zhao, X., Cai, Y.X., Zhang, C., and Bao, W.W., Experimental Study on the Thermal Management of High-Power LED Headlight Cooling Device Integrated with Thermoelectric Cooler Package, Energy Convers. Manage., vol. 101, pp. 532-540, 2015.
-
Wyszecki, G. and Stiles, W.S., Color Science, New York: Wiley, 1982.
-
Yan, L., Cordero, N., and Frank, B., Liquid Cooling of Bright LEDs for Automotive Applications, Appl. Therm. Eng., vol. 29, pp. 1239-1244, 2009.
-
Yang, K.S, Chung, C.H., Tu, C.W., Wong, C.C., Yang, T.Y., and Lee, M.T., Thermal Spreading Resistance Characteristics of a High Power Light Emitting Diode Module, Appl. Therm. Eng., vol. 70, pp. 361-368, 2014.
-
Yang, K.S., Ding, W.T., Yeh, C.T., Lee, M.T., and Wang, C.C., An Experimental and Analytical Investigation of the Photo-Thermal-Electro Characteristics of a High Power InGaN LED Module, Appl. Therm. Eng., vol. 98, pp. 756-765, 2016.
-
Yung, K.C., Liem, H., Choy, H.S., and Lun, W.K., Thermal Performance of High Brightness LED Array Package on PCB, Int. Commun. Heat Mass Transf., vol. 37, pp. 1266-1272, 2010.
-
Zheng, X.F., Liu, C.X., Yan, Y.Y., and Wang, Q., A Review of Thermoelectrics Research-Recent Developments and Potentials for Sustainable and Renewable Energy Applications, Renew. Sustain. Energy Rev., vol. 32, pp. 486-503, 2014.