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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
SJR: 0.137 SNIP: 0.341 CiteScore™: 0.43

ISSN Imprimir: 1093-3611
ISSN On-line: 1940-4360

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.v2.i3.100
pages 419-429

INTERNAL STRESS ANALYSIS IN THIN METALLIC FILMS BY COMBINING CURVATURE AND X-RAY DIFFRACTION METHODS

V. Branger
Laboratoire de Metallurgie Physique - U.M.R. 6630 C.N.R.S. - Universite de Poitiers Bat. S.P.2M.I. - Bd 3 -Teleport 2 - BP 179 - 86960 Futuroscope cedex - France
V. Pelosin
Laboratoire de Mecanique et Physique des Materiaux - UMR 6617 CNRS E.N.S.M.A. - Site du futuroscope - BP 109 - 86960 Futuroscope cedex - France
Ph. Goudeau
Laboratoire de Metallurgie Physique - U.M.R. 6630 C.N.R.S. - Universite de Poitiers Bat. S.P.2M.I. - Bd 3 -Teleport 2 - BP 179 - 86960 Futuroscope cedex - France
K.F. Badawi
Laboratoire de Metallurgie Physique - U.M.R. 6630 C.N.R.S. - Universite de Poitiers Bat. S.P.2M.I. - Bd 3 -Teleport 2 - BP 179 - 86960 Futuroscope cedex - France

RESUMO

Structural and mechanical state of Cu and Mo thin films (200 nm) deposited on oxidised Si substrates have been analysed using X ray diffraction and mechanical spectroscopy. In this paper, we show the interest and the complementarity of the two methods to investigate stresses in thin films. The in plane stress values determined by the two methods in the copper films are in good agreement. In the case of molybdenum films, the values obtained indicate a very high compressive stress state, but we observed a large difference (≈ 2 GPa) between the stress magnitude determined with the two methods : 4.5 and 2.3 GPa for X-rays and curvature methods respectively. In order to explain this stress level difference which is certainly correlated to a particular structure of the deposits, we followed the evolution of the internal friction Q−1 and the mechanical state during thermal cycling in a temperature range 300-760 K.