Inscrição na biblioteca: Guest
Portal Digital Begell Biblioteca digital da Begell eBooks Diários Referências e Anais Coleções de pesquisa
International Journal for Multiscale Computational Engineering
Fator do impacto: 1.016 FI de cinco anos: 1.194 SJR: 0.554 SNIP: 0.82 CiteScore™: 2

ISSN Imprimir: 1543-1649
ISSN On-line: 1940-4352

International Journal for Multiscale Computational Engineering

DOI: 10.1615/IntJMultCompEng.2012003172
pages 45-57

MULTISCALE MICROMORPHIC MODEL FOR THE PLASTIC RESPONSE OF CU THIN FILM

Zhaohui Zhang
School of Aerospace, Tsinghua University
Zhuo Zhuang
Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084
X. C. You
Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
Z. L. Liu
Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
J. F. Nie
Failure Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
Yuan Gao
Applied Mechanics Laboratory, School of Aerospace, Tsinghua University, Beijing 100084 China

RESUMO

In this article, the multiscale micromorphic plasticity model is employed to quantitatively investigate the size and Bauschinger effects of freestanding Cu thin films in a continuum sense. The simulations, including the single-layer and multi-layer models, are carried out within a two-dimensional plane strain framework with the passivation layer modeled as the higher-order boundary condition. The computational results are compared with the experimental data of two sets of films consisting of the electroplated and sputtered films. It is found that for the electroplated films, the effects of film thickness are in quite good consistent with the experimental data. The strengthening factor charactering the passivation effect agrees well with the experiments for both the electroplated and sputtered films. The boundary layers near the internal interfaces (grain boundaries or film-passivation layers) are captured. The accumulation of the backstress scales almost linearly with the pre-strain. In the multi-layer polycrystal model, the yield strength of electroplated films obeys a nonlinear dependence on grain boundary density.


Articles with similar content:

Calibration of Nanocrystal Grain Boundary Model Based on Polycrystal Plasticity Using Molecular Dynamics Simulations
International Journal for Multiscale Computational Engineering, Vol.8, 2010, issue 5
Sangmin Lee, Veera Sundararaghavan
Elastic Waves at Porous/Porous Elastic Half-Spaces Saturated by Two Immiscible Fluids
Journal of Porous Media, Vol.10, 2007, issue 8
S. K. Tomar, Ashish Arora
MODELING OF SUBGRAIN’S CRYSTALLOGRAPHIC MISORIENTATION DISTRIBUTION
Nanoscience and Technology: An International Journal, Vol.9, 2018, issue 4
Peter V. Trusov, Nikita S. Kondratev
FINITE-ELEMENT ANALYSIS OF GRAIN-MATRIX MICRO-CRACKING IN SHALE WITHIN THE CONTEXT OF A MULTISCALE MODELING APPROACH FOR FRACTURE
International Journal for Multiscale Computational Engineering, Vol.10, 2012, issue 5
Sheng-Kai Yu, Richard A. Regueiro
MODELING PLASTIC DEFORMATION OF NANO/SUBMICRON-SIZED TUNGSTEN PILLARS UNDER COMPRESSION: A COARSE-GRAINED ATOMISTIC APPROACH
International Journal for Multiscale Computational Engineering, Vol.16, 2018, issue 4
Shuozhi Xu