RT Journal Article ID 207e16e938c09c9b A1 El-Genk, Mohamed S. A1 Suszko, Arthur T1 SATURATION AND SUBCOOLED CHF CORRELATIONS FOR PF-5060 DIELECTRIC LIQUID ON INCLINED ROUGH COPPER SURFACES JF Multiphase Science and Technology JO MST YR 2014 FD 2015-02-13 VO 26 IS 2 SP 139 OP 170 K1 CHF K1 dielectric liquids K1 immersion cooling K1 nucleate boiling K1 liquid subcooling K1 surface roughness and inclination AB Pool-boiling experiments investigated the critical heat flux (CHF) for degassed PF-5060 dielectric liquid on inclined and uniformly heated 10×10 mm rough copper (Cu) surfaces. The experiments tested 13 surfaces with average roughness, Ra = 0.039 (smooth-polished), 0.134, 0.21, 0.28, 0.33, 0.58, 0.71, 0.80, 0.925, 1.00, 1.21, 1.44, and 1.79 μm, at inclination angles, θ = 0° (upward facing); 60°, 90° (vertical); and 120°, 150°, 160°, 170°, and 180° (downward facing). In addition, liquid subcooling in the experiments, ΔTsub, varied from 0 K (saturation) to 30 K. The CHF increased with increasing both surface roughness and liquid subcooling, but decreased with increasing inclination angle. For all inclinations, CHFsat on the roughest surface is ~35% higher than on the smoothpolished Cu. Moreover, regardless of Ra, CHFsat values in the downward facing orientation (180°) are typically ~31% of those in the upward facing orientation (0°). CHF in the upward facing orientation increases linearly with increasing liquid subcooling at a rate of ~2.2%/K, independent of Ra. This rate increases with increasing the inclination angle to as much as 4%/K in the downward facing orientation. The developed CHF correlation based on the present database accounts for surface roughness and inclination angle, and the liquid's subcooling and physical properties and agrees with the experimental data to within ±10%. PB Begell House LK https://www.dl.begellhouse.com/journals/5af8c23d50e0a883,39519b90299453ad,207e16e938c09c9b.html