RT Journal Article
ID 207e16e938c09c9b
A1 El-Genk, Mohamed S.
A1 Suszko, Arthur
T1 SATURATION AND SUBCOOLED CHF CORRELATIONS FOR PF-5060 DIELECTRIC LIQUID ON INCLINED ROUGH COPPER SURFACES
JF Multiphase Science and Technology
JO MST
YR 2014
FD 2015-02-13
VO 26
IS 2
SP 139
OP 170
K1 CHF
K1 dielectric liquids
K1 immersion cooling
K1 nucleate boiling
K1 liquid subcooling
K1 surface roughness and inclination
AB Pool-boiling experiments investigated the critical heat flux (CHF) for degassed PF-5060 dielectric liquid on inclined and uniformly heated 10×10 mm rough copper (Cu) surfaces. The experiments tested 13 surfaces with average roughness, Ra = 0.039 (smooth-polished), 0.134, 0.21, 0.28, 0.33, 0.58, 0.71, 0.80, 0.925, 1.00, 1.21, 1.44, and 1.79 μm, at inclination angles, θ = 0° (upward facing);
60°, 90° (vertical); and 120°, 150°, 160°, 170°, and 180° (downward facing). In addition, liquid subcooling
in the experiments, ΔTsub, varied from 0 K (saturation) to 30 K. The CHF increased with
increasing both surface roughness and liquid subcooling, but decreased with increasing inclination
angle. For all inclinations, CHFsat on the roughest surface is ~35% higher than on the smoothpolished Cu. Moreover, regardless of Ra, CHFsat values in the downward facing orientation (180°)
are typically ~31% of those in the upward facing orientation (0°). CHF in the upward facing orientation
increases linearly with increasing liquid subcooling at a rate of ~2.2%/K, independent of
Ra. This rate increases with increasing the inclination angle to as much as 4%/K in the downward
facing orientation. The developed CHF correlation based on the present database accounts for surface
roughness and inclination angle, and the liquid's subcooling and physical properties and agrees with
the experimental data to within ±10%.
PB Begell House
LK https://www.dl.begellhouse.com/journals/5af8c23d50e0a883,39519b90299453ad,207e16e938c09c9b.html