RT Journal Article ID 6a0d956609a3f41a A1 Vasiliev, Jr, L. L. A1 Kulakov, Andrei G. T1 DEVELOPMENT OF ADVANCED MINIATURE COPPER HEAT PIPES FOR A COOLING SYSTEM OF A MOBILE PC PLATFORM JF Heat Pipe Science and Technology, An International Journal JO HPST YR 2010 FD 2010-04-13 VO 1 IS 1 SP 59 OP 70 K1 electronics cooling K1 miniature heat pipe K1 evaporation K1 porous media AB At present, miniature heat pipes are widely used for cooling systems of mobile PCs. This paper presents an overview of the development of miniature heat pipes (MHP) with a sintered copper wick with emphasis to different ways of heat pipe wick optimization. Several designs of cylindrical heat pipes with 4-, 5-, and 6-mm outer diameter and 200-mm length, which are the most attractive for the CPU cooling system, have been tailored, tested, and compared to theoretical values in this study to evaluate its thermal performances. A new design of 4- and 5-mm-outer diameter miniature copper heat pipes with innovative wicks is suggested as a promising candidate for present and future cooling systems of high-power mobile PC platforms. PB Begell House LK https://www.dl.begellhouse.com/journals/4b0844fc3a2ef17f,60441b0204b0f441,6a0d956609a3f41a.html