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EFFECTS OF THERMOPYHSICAL PROPERTIES AND ENTRANCE REGION ON THE DIMENSIONAL OPTIMIZATION OF MICROCHANNEL HEAT SINKS

DOI: 10.1615/ICHMT.2011.TMNN-2011.200
9 pages

Goker Turkakar
Middle East Technical University, Mechanical Engineering Department Ankara, Turkey

Tuba Okutucu-Ozyurt
Dept. of Mechanical Engineering, Micro and Nanotechnology Program, Graduate School of Arts and Sciences, Middle East Technical University, Dumlupinar Blv. No 1, 06800, Ankara, Turkey

Resumo

Dimensional optimization of silicon microchannel heat sinks is performed by minimizing the total thermal resistance. Intel Core i7-900 Desktop Processor of chip core dimensions of 1.891 cm × 1.44 cm is considered as a reference processor which is reported to dissipate 130 W of heat. The properties are evaluated at the area weighted average of the fluid inlet and iteratively calculated outlet temperatures. The effects of the thermal and hydrodynamic entrance regions on heat transfer and flow are also investigated. The results of the optimization code agreed very well with available ones in the literature.

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