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Volume 18

DOI: 10.1615/AnnualRevHeatTransfer.v18
ISBN: 978-1-56700-449-6 (Print)
ISBN: 978-1-56700-450-2 (Online)
ISSN: 1049-0787

Sumário:

INTRODUCTION: CHALLENGES AND OPPORTUNITIES IN THERMAL MANAGEMENT TECHNOLOGIES
Evelyn N. Wang
pages 1-6
DOI: 10.1615/AnnualRevHeatTransfer.2015012604
$35.00
NEAR-JUNCTION THERMAL MANAGEMENT: THERMAL CONDUCTION IN GALLIUM NITRIDE COMPOSITE SUBSTRATES
Jungwan Cho, Zijian Li, Mehdi Asheghi, Kenneth E. Goodson
pages 7-45
DOI: 10.1615/AnnualRevHeatTransfer.2015011335
$35.00
NANOSTRUCTURED THERMAL INTERFACES
John H. Taphouse , Baratunde A. Cola
pages 47-99
DOI: 10.1615/AnnualRevHeatTransfer.2015011512
$35.00
RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
Scott M. Thompson, Hongbin Ma
pages 101-153
DOI: 10.1615/AnnualRevHeatTransfer.2015011163
$35.00
ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Yoav Peles
pages 155-198
DOI: 10.1615/AnnualRevHeatTransfer.2015011144
$35.00
THERMAL MANAGEMENT TECHNOLOGIES FOR 3D STACKED ICS
Zhimin Wan, Yogendra K. Joshi
pages 199-244
DOI: 10.1615/AnnualRevHeatTransfer.2016011800
$35.00
TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS
TieJun Zhang
pages 245-328
DOI: 10.1615/AnnualRevHeatTransfer.2015012305
$35.00
THERMOELECTRIC MICROCOOLERS−ACTIVE THERMAL CONTROL MODULES
Michael Manno, Bao Yang, Avram Bar-Cohen
pages 329-370
DOI: 10.1615/AnnualRevHeatTransfer.2015011140
$35.00
THERMAL MANAGEMENT IN LED PACKAGING AND APPLICATIONS
Xiaobing Luo, Run Hu
pages 371-414
DOI: 10.1615/AnnualRevHeatTransfer.2015011154
$35.00
INDEX

415 pages
DOI: 10.1615/AnnualRevHeatTransfer.v18.100

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