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INTRODUCTION: CHALLENGES AND OPPORTUNITIES IN THERMAL MANAGEMENT TECHNOLOGIES

DOI: 10.1615/AnnualRevHeatTransfer.2015012604
pages 1-6

Evelyn N. Wang
Device Research Laboratory, Massachusetts Institute of Technology, Cambridge, MA 02139, USA


KEY WORDS: thermal management, near junction, device, package, system, cooling, electronics

Abstract

Significant advancements in thermal management technologies have been made in recent years for defense, commercial, and space systems. This volume summarizes important progress in addressing challenges for electronics cooling ranging from near the junction of a device to the system level. This chapter provides an introduction and overview of this volume. The first chapter examines GaN composite substrates for near-junction thermal management of high power, wide band gap power amplifiers. The next chapter discusses opportunities in nanostructured thermal interface materials. The following chapter presents recent developments in thermal ground planes as heat spreaders. The subsequent four chapters focus on active cooling approaches including one on single-phase liquid flow, one for 3D integrated circuits, one on flow control of two-phase microchannel cooling systems, and one on thermoelectrics for hotspot cooling. The last chapter discusses thermal management in LED packaging.

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS