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TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS

DOI: 10.1615/AnnualRevHeatTransfer.2015012305
pages 245-328

TieJun Zhang
Khalifa University


KEY WORDS: Electronics Cooling, Flow Boiling, Heat Flux Removal, Refrigeration Cooling, Transient Analysis, Two-Phase Flow

Abstract

Effective and efficient cooling has become a bottleneck for emerging high heat flux devices and systems from both performance and sustainability perspectives. For rapidly developing high-power microelectronic, avionic, and photonic systems, thermal management is essential to ensure high heat flux removal and performance. Two-phase cooling is a promising approach to efficiently remove heat from solid-state devices in a broad range of applications. To achieve the desired cooling capacity and energy efficiency, careful design of thermal management systems and their operation must be systematically investigated. In fact, very few reviews are available to aid in the design and transient operation of low-temperature, two-phase cooling systems for heat flux removal. This chapter reviews transient and active thermal management techniques in the literature. Recent progress on thermal management system modeling and active flow control are discussed in order to develop more advanced transient two-phase cooling systems.

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS