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NANOSTRUCTURED THERMAL INTERFACES

DOI: 10.1615/AnnualRevHeatTransfer.2015011512
pages 47-99

John H. Taphouse
Georgia Institute of Technology, G.W. Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, GA 30332-0405

Baratunde A. Cola
Georgia Institute of Technology, G.W. Woodruff School of Mechanical Engineering, 801 Ferst Drive, Atlanta, GA 30332-0405; Georgia Institute of Technology, School of Materials Science and Engineering, 771 Ferst Drive, Atlanta, GA 30332-0245; Carbice Nanotechnologies, Inc., 397 8th Street NE, Atlanta, GA 30309


KEY WORDS: thermal interface materials, nanomaterials, conduction

Abstract

The continual miniaturization and proliferation of electronics necessitates the development of thermal interface materials with unprecedented thermal and mechanical properties. Over the past decade, nanostructuring of thermal interface materials has emerged as a promising method for addressing this mounting problem. This chapter summarizes established methods for nanostructuring thermal interface materials and highlights emerging strategies.

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS