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RECENT ADVANCES IN ADSORPTION-BASED HEATING AND COOLING SYSTEMS

DOI: 10.1615/AnnualRevHeatTransfer.2016015440
pages 199-239

Shankar Narayanan
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA; Currently, Department of Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY

Xiansen Li
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA

Hyunho Kim
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA

Ari Umans
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA

Evelyn N. Wang
Device Research Laboratory, Massachusetts Institute of Technology, Cambridge, MA 02139, USA


KEY WORDS: Adsorption cooling and refrigeration, HVAC, Thermal energy storage, Adsorption heat pump

Abstract

Adsorption heat pumps (AHPs) are capable of providing both heating and cooling to meet the growing demands for climate control. In contrast to work-driven vapor compression systems, heat-driven adsorption heat pumps allow the use of thermal energy and environmentally benign refrigerants for operation. However, adsorption systems have typically faced challenges associated with achieving higher power densities, and heating and cooling rates due to poor transport characteristics. In addition, energy losses and irreversibilities in AHPs can significantly decrease the overall coefficient of performance (COP). Therefore, techniques that facilitate efficient thermal and vapor transport are desirable in AHPs. In this chapter, we describe how recent advances in the development of novel adsorbents, their interface with heat exchangers, innovative bed designs, and integration with auxiliary components can promote efficient heat and mass transfer. Furthermore, we describe how AHP systems can be operated to leverage heat and mass recovery to enhance the overall COP. With the integration of innovations at the material, component, and system level, the next-generation AHPs can be environmentally sustainable and address the rising demands for heating and cooling.

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS