CHANG-LIN TIEN'S CONTRIBUTIONS TO MICRO- AND NANOSCALE HEAT TRANSFER
Professor Tien pioneered and nurtured the field of micro- and nanoscale heat transfer. With his method of pushing to extremes in research and his keen physical insights, he started research on microscale radiation and heat conduction phenomena early on in his career. His work in the late 1960s and early 1970s on small gap effects on radiation heat transfer is still widely referenced in current research literature. In the 1980s, microelectronics cooling became a hot topic in the heat transfer community. Professor Tien, with his deep physical insights, saw a wide range of fundamental problems beyond the heat removal from computer chips, and started a systematic push in understanding micro- and nanoscale heat transfer phenomena. His rise, first to the post of executive vice chancellor at UC Irvine, and later to chancellor at UC Berkeley, did not slow down his research agenda for this field. On the contrary, he led the charge and pioneered a wide range of research topics in micro- and nanoscale heat transfer that continue to be among the most important topics today. He also used his great visibility to push the field of micro- and nanoscale heat transfer. He founded the journal of Microscale Thermophysical Engineering, and was the founding father of a U.S.-Japan seminar series on molecular to microscale heat transfer phenomena that has been held every three years, starting in 1993. He also organized two workshops in microscale heat transfer in U.S. and one in China. He, together with Majumdar and Gerner, edited the first book in this field, Microscale Energy Transport . His direct leadership in micro-/nanoscale heat transfer research and in the heat transfer community not only greatly influenced the course of this field, but also had great impact far beyond the field of heat transfer. As a member of the U.S. National Science Board, he played an active role in the birth of the National Nanotechnology Initiative.
ARHT Digital Library
Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS
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