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Volume 10

DOI: 10.1615/AnnualRevHeatTransfer.v10

ISBN: 1-56700-129-7
ISSN: 1049-0787

Table of Contents:

Contributors

pages vii-viii
DOI: 10.1615/AnnualRevHeatTransfer.v10.10
PREFACE

ix pages
DOI: 10.1615/AnnualRevHeatTransfer.v10.20
NEW DEVELOPMENTS IN BIOHEAT AND MASS TRANSFER MODELING
Lisa X. Xu
pages 1-23
DOI: 10.1615/AnnualRevHeatTransfer.v10.30
$35.00
PLASMA CHEMICAL THERMOPHYSICS IN THE APPLICATION TO MATERIAL CONVERSION PROCESSES
Ken Okazaki, Takayuki Watanabe
pages 25-100
DOI: 10.1615/AnnualRevHeatTransfer.v10.40
$35.00
THEORY AND EXPERIMENTS ON SCATTERING FROM ROUGH INTERFACES
K. Tang, Y. Yang, Richard O. Buckius
pages 101-140
DOI: 10.1615/AnnualRevHeatTransfer.v10.50
$35.00
MOLECULAR DYNAMICS IN MICROSCALE THERMOPHYSICAL ENGINEERING
Fu-Chu Chou, Jennifer R. Lukes, Xin-Gang Liang, Koji Takahashi, Chang-Lin Tien
pages 141-176
DOI: 10.1615/AnnualRevHeatTransfer.v10.60
$35.00
A REVIEW OF TURBULENT HEAT TRANSFER MODELING
Ronald M. C. So, C. G. Speziale
pages 177-220
DOI: 10.1615/AnnualRevHeatTransfer.v10.70
$35.00
INITIATION AND GROWTH OF SOLIDIFICATION SHRINKAGE VOIDS
C. David Sulfredge, Louis Chow, Kaveh A. Tagavi
pages 221-278
DOI: 10.1615/AnnualRevHeatTransfer.v10.80
$35.00

ARHT Digital Library

Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS