PHOTOACOUSTIC TECHNIQUE FOR THERMAL CONDUCTIVITY AND THERMAL INTERFACE MEASUREMENTS
The photoacoustic (PA) technique is one of many techniques for characterizing thermal conductivity of materials, including thermal interface conductance or resistance. Compared with other techniques, the PA method is relatively simple, yet is able to provide accurate thermal conductivity data over a wide range of materials and properties. In the last decade, the PA method has been developed and employed for measuring thermal properties of many materials. In this chapter, we will discuss the theory of the PA method for thermal conductivity/thermal interface resistance measurement. We will also describe experimental implementation of the PA method. Finally, we will discuss a recent application of using the PA method for characterizing thermal interface resistance of carbon nanotubeâ€“based thermal interface materials.
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Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS
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