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Heat Transfer Research
Импакт фактор: 0.404 5-летний Импакт фактор: 0.8 SJR: 0.264 SNIP: 0.504 CiteScore™: 0.88

ISSN Печать: 1064-2285
ISSN Онлайн: 2162-6561

Выпуски:
Том 50, 2019 Том 49, 2018 Том 48, 2017 Том 47, 2016 Том 46, 2015 Том 45, 2014 Том 44, 2013 Том 43, 2012 Том 42, 2011 Том 41, 2010 Том 40, 2009 Том 39, 2008 Том 38, 2007 Том 37, 2006 Том 36, 2005 Том 35, 2004 Том 34, 2003 Том 33, 2002 Том 32, 2001 Том 31, 2000 Том 30, 1999 Том 29, 1998 Том 28, 1997

Heat Transfer Research

DOI: 10.1615/HeatTransRes.2016015276
pages 827-848

NUMERICAL SIMULATION OF A BELLOWS-TYPE RECIPROCATING MECHANISM-DRIVEN HEAT LOOP (RMDHL)

Olubunmi T. Popoola
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174, USA
Soheil Soleimani
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174, USA
Yiding Cao
Department of Mechanical and Materials Engineering, Florida International University, Miami, Florida 33174

Краткое описание

A bellows-type Reciprocating Mechanism-Driven Heat Loop (RMDHL) could attain a high heat transfer rate through reciprocating flow of the working fluid inside a heat transfer device while maintaining substantial temperature uniformity over its evaporator section. The objective of this paper is to numerically simulate a bellows-type RMDHL to predict its operational performance under different working conditions as well as a conventional dynamic pump-driven heat loop (DPDHL) as a benchmark for comparison. The numerical results are also compared with relevant experimental data with good agreement. The results indicate that the bellows-type RMDHL can meaningfully reduce the peak temperature of an electronic device and result in a significantly more uniform temperature across the electronic device. Considering the advantage of coolant leakage free for electronics-related applications, the single-phase bellows-type RMDHL could be an alternative to a conventional Liquid Cooling System (LCS) for electronic cooling applications.

Ключевые слова: heat loop, reciprocating flow, cooling, heat flux

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