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ISSN Печать: 1065-5131
ISSN Онлайн: 1563-5074
Indexed in
Heat Transfer from Chips to Dielectric Coolant: Enhanced Pool Boiling Versus Jet-Impingement Cooling
Краткое описание
This paper reports the study on heat transfer from a 1 cm2-area chip to fluorinert FC−72. Two sets of data are reviewedone obtained with the microporous stud in pool boiling situation, and the other with multiple jets onto a smooth surface. They are compared to find the relative merits of these two modes of cooling. The option of cooling method is shown to depend on the chip temperature. The examples are shown using the data of the microporous stud and the 25-impinging-jets. When the chip temperature is required to be lower than 60° C, the jet-impingement is almost exclusively superior. Relaxation of the maximum allowable chip temperature to 70° C moves the advantage to pool boiling in a large zone of the velocity-subcooling plane. A further increase of the chip temperature reduces the zone over which pool boiling is favorable.
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Amon Cristina H. , Yao S.-C. , Wu C.-F. , Hsieh C.-C. , Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics , Journal of Heat Transfer, 127, 1, 2005. Crossref
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Eckert E.R.G., Goldstein R.J., Ibele W.E., Patankar S.V., Simon T.W., Strykowski P.J., Tamma K.K., Kuehn T.H., Bar-Cohen A., Heberlein J.V.R., Hofeldt D.L., Davidson J.H., Bischof J., Kulacki F., Heat transfer—a review of 1994 literature, International Journal of Heat and Mass Transfer, 40, 16, 1997. Crossref
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Bar-Cohen A., Arik M., Ohadi M., Direct Liquid Cooling of High Flux Micro and Nano Electronic Components, Proceedings of the IEEE, 94, 8, 2006. Crossref
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Amon Cristina H., Murthy Jayathi, Yao S.C., Narumanchi Sreekant, Wu Chi-Fu, Hsieh Cheng-Chieh, MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics, Experimental Thermal and Fluid Science, 25, 5, 2001. Crossref
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Narumanchi Sreekant V. J. , Amon Cristina H. , Murthy Jayathi Y. , Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena , Journal of Electronic Packaging, 125, 3, 2003. Crossref
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Devahdhanush V.S., Mudawar Issam, Review of Critical Heat Flux (CHF) in Jet Impingement Boiling, International Journal of Heat and Mass Transfer, 169, 2021. Crossref