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Journal of Enhanced Heat Transfer
Импакт фактор: 0.562 5-летний Импакт фактор: 0.605 SJR: 0.175 SNIP: 0.361 CiteScore™: 0.33

ISSN Печать: 1065-5131
ISSN Онлайн: 1026-5511

Выпуски:
Том 26, 2019 Том 25, 2018 Том 24, 2017 Том 23, 2016 Том 22, 2015 Том 21, 2014 Том 20, 2013 Том 19, 2012 Том 18, 2011 Том 17, 2010 Том 16, 2009 Том 15, 2008 Том 14, 2007 Том 13, 2006 Том 12, 2005 Том 11, 2004 Том 10, 2003 Том 9, 2002 Том 8, 2001 Том 7, 2000 Том 6, 1999 Том 5, 1998 Том 4, 1997 Том 3, 1996 Том 2, 1995 Том 1, 1994

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.v16.i3.20
pages 225-236

Heat Transfer and Pressure Drop Characteristics in Dielectric Flow in Surface-Augmented Microchannels

Rory J. Jones
Goodman Manufacturing Company
Daniel T. Pate
Applied Technical Services, 1049 Triad Court, Marietta, GA 30062
Naveenan Thiagarajan
Department of Mechanical Engineering, Auburn University, AL 36849; GE Global Research, Niskayuna, New York 12309, USA
Sushil Bhavnani
Department of Mechanical Engineering, Auburn University, Auburn, Alabama 36849, USA

Краткое описание

Microchannel heat sinks incorporating phase-change can be an effective remedy to problems encountered with extreme heat fluxes in modern day micro processor chips. An augmented surface has been created that consists of 20-micron re-entrant cavities etched in the base of each channel in the microchannel array. These cavities significantly impact the flow regime by promoting stable nucleate boiling. The phase-change thermal transport reported here is carried out on microchannel heat sinks etched in silicon and cooled by the dielectric fluid FC72. Heat transfer coefficients and pressure drops reported were measured using a versatile continuous flow loop that permitted experiments at a variety of inlet subcooling values and pressures. The results show stable thermal performance with low pressure drops that were correctly represented by the homogeneous two-phase model. The highest pressure drop measured was 17.5 kPa at a mass flux of 2138 kg/m2·s and at an inlet subcooling of 5°C.


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