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Journal of Enhanced Heat Transfer
Импакт фактор: 1.406 5-летний Импакт фактор: 1.075 SJR: 0.287 SNIP: 0.653 CiteScore™: 1.2

ISSN Печать: 1065-5131
ISSN Онлайн: 1026-5511

Выпуски:
Том 27, 2020 Том 26, 2019 Том 25, 2018 Том 24, 2017 Том 23, 2016 Том 22, 2015 Том 21, 2014 Том 20, 2013 Том 19, 2012 Том 18, 2011 Том 17, 2010 Том 16, 2009 Том 15, 2008 Том 14, 2007 Том 13, 2006 Том 12, 2005 Том 11, 2004 Том 10, 2003 Том 9, 2002 Том 8, 2001 Том 7, 2000 Том 6, 1999 Том 5, 1998 Том 4, 1997 Том 3, 1996 Том 2, 1995 Том 1, 1994

Journal of Enhanced Heat Transfer

DOI: 10.1615/JEnhHeatTransf.2012003016
pages 331-341

COMPENSATION OF THREE-DIMENSIONAL HEAT CONDUCTION INSIDE WALL IN HEAT TRANSFER MEASUREMENT OF DIMPLED SURFACE BY USING TRANSIENT TECHNIQUE

Satomi Nishida
Department of Mechanical Systems Engineering, Tokyo University of Agriculture & Technology, Naka-cho 2-24-16, Koganei, Tokyo 184-8588, Japan
Akira Murata
Tokyo University of Agriculture and Technology
Hiroshi Saito
Mechanical Systems Engineering Course, Tokyo Metropolitan College of Industrial Technology, 1-10-40 Higashi-Ohi, Shinagawa, Tokyo 140-0011, Japan
Kaoru Iwamoto
Department of Mechanical Engineering, Tokyo University of Science, Noda-shi, Chiba 278-8510; Department of Mechanical System Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Nakacho, Koganei, Tokyo 184-8588, Japan

Краткое описание

The transient technique using infrared thermography or liquid crystal has been widely used for measuring the distribution of local heat transfer coefficients. In this technique, wall surface temperature is measured, and the heat transfer coefficient is calculated so as to accord the measured temperature with the theoretical solution of a one-dimensional heat conduction problem. In actual cases of complicated surface geometry, however, three-dimensional heat conduction, caused by the three-dimensionality of the wall surface and the distribution of heat transfer coefficient, occurs in the wall. In this study, the heat transfer enhancement on the hemispherically dimpled surface was measured with an infrared camera, while the three-dimensional heat conduction in the wall was numerically calculated. In the compensation process, modification of the heat transfer coefficient was repeated until the numerical result agreed with the measured surface temperature. The present results showed that the heat transfer coefficient near the dimple edge was overrated, while that within the cavity was underrated. The maximum error induced by the three-dimensional heat conduction was +50% on the leading edge of the dimple, and the error in the other area was about −20% at most. At the dimple edge, the convex geometry increased the surface area where the heat flew into the wall, and consequently the temperature rise became larger than the flat part. On the other hand, within the dimple, the concave geometry formed the radially expanding heat conduction area, and the temperature became lower. The principal factor contributing to the error of the measurement is the three-dimensionality of the surface.


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