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Journal of Flow Visualization and Image Processing
SJR: 0.161 SNIP: 0.312 CiteScore™: 0.5

ISSN Печать: 1065-3090
ISSN Онлайн: 1940-4336

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Journal of Flow Visualization and Image Processing

DOI: 10.1615/JFlowVisImageProc.v16.i4.20
pages 295-301

HAIR-PIN VORTICES FROM THE COMBINED WAKE OF TWO RECTANGULAR CYLINDERS AT A LOW REYNOLDS NUMBER

Y. C. Huang
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan
Jung-Hua Chou
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan, 701

Краткое описание

Experiments are conducted to study the wake flow patterns of two rectangular cylinders at a Reynolds number of 292. The cylinders are parallel to the flow direction. The gap ratio between the cylinders, dss/w, is fixed to 0.4/1. The results show that lifted streamlines inside the gap between the cylinders are entrained into a series of hair-pin vortices at farther downstream locations. The hair-pin vortices are formed from the combined wake of the cylinders and are lifted farther away from the bottom wall while they are being swept downstream. The scale of the hair-pin vortices is relatively large as compared to the boundary layer thickness of the incoming flow.

ЛИТЕРАТУРА

  1. J. H. Chou, S. B. Chiu, and M. D. Lin, Near Surface Flow Patterns of Two Rectangular Cylinders at a Low Reynolds Number.

  2. E. M. Sparrow, J. E. Neithammer, and A. Chaboki, Heat Transfer and Pressure Drop Characteristics of Arrays of Rectangular Modules Encounted in Electronic Equipment.

  3. E. M. Sparrow, S. B. Vemuri, and D. S. Kadle, Enhanced and Local Heat, Pressure Drop and Flow Visualization for Arrays of Block-Like Electronic Cylinder.

  4. E. M. Sparrow, A. A. Yanezmoreno, and D. R. Otis, Jr., Convective Heat Transfer Response to Height Difference in an Array of Block-Like Electronic Cylinders.

  5. A. T. Patera and B. B. Mikic, Exploiting Hydrodynamic Instabilities, Resonant Heat Transfer Enhancement.

  6. N. Ashiwake, W. Nakayama, D. Daikaoku, and F. Kobayashi, Forced Convec-tive Heat Transfer from LSI Package in an Air-Cooled Wiring Card Array.

  7. J. H. Chou and J. Lee, Reducing Flow Non-Uniformities in LSI Packages by Vortex Generators.

  8. J. C. R. Hunt, C. J. Abell, J. A. Peterka, and H. Woo, Kinematical Studies of the Flows around Free or Surface-Mounted Obstacles, Applying Topology to Flow Visualization.

  9. C. J. Baker, The Laminar Horseshoe Vortex.

  10. C. J. Baker, The Turbulent Horseshoe Vortex.

  11. K. Azar and E. T. Russell, Effect of Cylinder Layout and Geometry on the Flow Distribution in Electronics Circuit Packs.

  12. M. Hayashi, A. Sakurai, and Y. Ohya, Wake Interference of a Row of Normal Flat Plates Arranged Side by Side in a Uniform Flow.


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