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High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
SJR: 0.137 SNIP: 0.341 CiteScore™: 0.43

ISSN Печать: 1093-3611
ISSN Онлайн: 1940-4360

Выпуски:
Том 23, 2019 Том 22, 2018 Том 21, 2017 Том 20, 2016 Том 19, 2015 Том 18, 2014 Том 17, 2013 Том 16, 2012 Том 15, 2011 Том 14, 2010 Том 13, 2009 Том 12, 2008 Том 11, 2007 Том 10, 2006 Том 9, 2005 Том 8, 2004 Том 7, 2003 Том 6, 2002 Том 5, 2001 Том 4, 2000 Том 3, 1999 Том 2, 1998 Том 1, 1997

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

Купить выпуск $314.00 Том 22, 2018 Выпуск 1

DOI: 10.1615/HighTempMatProc.v22.i1

Содержание:

CHARACTERISTIC FEATURES OF HEATING SEMICONDUCTOR SILICON STRUCTURES DURING RAPID THERMAL TREATMENT IN THE VLSI TECHNOLOGY
Vitalii A. Bondariev, Valentina A. Gorushko, Vladimir A. Pilipenko, Vitaly A. Solodukha
pages 1-6
DOI: 10.1615/HighTempMatProc.2018026506
STRUCTURAL FEATURES OF THE FORMATION OF MULTICOMPONENT AND HIGH-ENTROPY TRANSITION METAL NITRIDE FILMS
Alexander D. Pogrebnjak, Alexander Goncharov, Andrey Yunda, Igor Shelest, Antoni Swic, Ihor Lebedynskyi
pages 7-15
DOI: 10.1615/HighTempMatProc.2018025792
INFLUENCE OF POST-WELDING HEAT TREATMENT ON MECHANICAL AND MICROSTRUCTURAL BEHAVIOR OF FRICTION STIR WELDED AA7075-T651 AND AA6061 DISSIMILAR JOINTS
Kunnathur Periyasamy Yuvaraj, P. Ashoka Varthanan, K. P. Boopathiraja
pages 17-34
DOI: 10.1615/HighTempMatProc.2018026422
MEASUREMENT OF THE MAGNETIC FIELD DISTRIBUTION IN A MAGNETICALLY INSULATED DIODE WITH EXTERNAL MAGNETIC FIELD
Wan-Ying Huang, Jie Shen, Hao-Wen Zhong, Jie Zhang, Guo-Ying Liang, Xiang Yu, Shi-Jian Zhang, Mo-Fei Xu, Jian-Wei Gao, Xiao Yu, Sha Yan, Xiao-Yun Le
pages 35-45
DOI: 10.1615/HighTempMatProc.2018026934
PREDICTION OF THERMAL HISTORY IN LASER METAL DEPOSITION
Saurav Kumar, Ajitanshu Vedrtnam
pages 47-62
DOI: 10.1615/HighTempMatProc.2018026699