Доступ предоставлен для: Guest
Портал Begell Электронная Бибилиотека e-Книги Журналы Справочники и Сборники статей Коллекции
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes
SJR: 0.137 SNIP: 0.341 CiteScore™: 0.43

ISSN Печать: 1093-3611
ISSN Онлайн: 1940-4360

Выпуски:
Том 23, 2019 Том 22, 2018 Том 21, 2017 Том 20, 2016 Том 19, 2015 Том 18, 2014 Том 17, 2013 Том 16, 2012 Том 15, 2011 Том 14, 2010 Том 13, 2009 Том 12, 2008 Том 11, 2007 Том 10, 2006 Том 9, 2005 Том 8, 2004 Том 7, 2003 Том 6, 2002 Том 5, 2001 Том 4, 2000 Том 3, 1999 Том 2, 1998 Том 1, 1997

High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes

DOI: 10.1615/HighTempMatProc.2016017251
pages 45-57

EFFECT OF THICKNESS ON THE PROPERTIES OF SPUTTERED Ti THIN FILMS ON AA1100 FOR MEMS APPLICATION

S. Venkatesan
Mechanical Engineering, Dr N.G.P. Institute of Technology, Coimbatore, Tamilnadu, India
M. Ramu
Department of Mechanical Engineering, PSG College of Technology, Coimbatore − 641004, Tamil nadu, India

Краткое описание

This paper reports the effect of thickness on the properties of titanium (Ti) films deposited on the AA1100 substrate using the DC magnetron sputtering technique. The structural and morphological characterization of Ti films was performed using X-ray diffraction (XRD), energy-dispersive X-ray (EDX), and scanning electron microscopy (SEM). The XRD pattern revealed that the films deposited using DC magnetron sputtering have the HCP symmetry with preferred orientation along the (111) plane for 150 µm thickness at the substrate temperature (673 K). The occurrence of metallic Ti was also confirmed by EDX analysis. SEM images illustrate that the finite-size grains uniformly distributed on the surface exhibit improved hardness, scratch resistance, good adhesion and excellent surface roughness of the film.

Ключевые слова: titanium, thin films, sputtering, hardness, MEMS

Articles with similar content:

CHARACTERIZATION AND EVALUATION OF THE MECHANICAL PROPERTIES OF A SPUTTERED Ti THIN FILM ON AA6061 SUBSTRATE
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes, Vol.20, 2016, issue 3
M. Yuvaraja, S. Venkatesan, M. Ramu
PROCESS OF FORMATION OF SPHEROIDAL GOLD PARTICLES AND OF NANOPHASES IN AlN−TiB2−TiSi2 COATINGS AFTER ANNEALING WITH SUBSEQUENT IMPLANTATION
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes, Vol.19, 2015, issue 2
Katerina Smyrnova, Konrad Kierczynski, Yoshihiko Takeda, Anatoliy Kupchishin, Henryk Komsta, Hiroshi Amekura, Marek Opielak, Bahyt Zhollybekov, Artem Demianenko
HIGH-ENTROPY TITANIUM-ALUMINUM DIFFUSION COATINGS ON NICKEL ALLOY
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes, Vol.20, 2016, issue 3
T. V. Loskutova, T. P. Hovorun, O. E. Datsyuk, V. G. Khyzhniak, N. A. Kharchenko, I. S. Pohrebova, A. I. Dehula, Yaroslav O. Kravchenko, I. Ya. Smokovich
ENHANCED INTERFACIAL HEAT TRANSFER OF LIQUID METAL ALLOY ON COPPER PLATE BY INTRODUCING MO BUFFER LAYER
International Heat Transfer Conference 16, Vol.14, 2018, issue
Hongbin Ma, Yangbo Deng, Zongyu Wang , Guoyou Wang , Huilong Yan, Yulong Ji, Bohan Tian, Wenbin Cui
CORROSION BEHAVIOR OF A Ni–TiO2 NANOCOMPOSITE COATED BY PULSE ELECTRODEPOSITION
High Temperature Material Processes: An International Quarterly of High-Technology Plasma Processes, Vol.22, 2018, issue 4
Gukan Rajaram, N. Saravanakumar, V. Sivaraman, S. Venkatesan, R. M. Arunachalam