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International Journal for Multiscale Computational Engineering

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ISSN Печать: 1543-1649

ISSN Онлайн: 1940-4352

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.4 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1.3 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 2.2 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00034 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.46 SJR: 0.333 SNIP: 0.606 CiteScore™:: 3.1 H-Index: 31

Indexed in

Multiscale Analysis of Microstructural Evolution and Degradation in Solder Alloys

Том 5, Выпуск 2, 2007, pp. 93-103
DOI: 10.1615/IntJMultCompEng.v5.i2.30
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Краткое описание

The past years have triggered considerable scientific efforts toward the predictive analysis of the reliability of solder connections in micro-electronics. Evidently, the replacement of the classical Sn-Pb solder alloy by a lead-free alternative constitutes the main motivation for this. This paper concentrates on the theoretical, computational, and experimental multiscale analysis of the microstructure evolution and degradation of the reference material, Sn-Pb, and the most promising alternative, a Sn-Ag-Cu (SAC) alloy. The microstructure evolution of Sn-Pb is analyzed on the basis of a representative volume element of the underlying microstructure. At this level, a phase field model is used to incorporate the thermally driven diffusion, thereby accounting for a nonlocal interfacial free energy. Starting from this phase field description of the microstructure, the intrinsic viscoplastic response and the damage developing in the phases and interfaces are analyzed. The correlation with experimentally found results is highlighted, whereby the microstructural dependence is the key issue. The lead-free SAC alloy is investigated at the material level by considering the mechanical and thermal anisotropy of the Sn-rich grains. It is shown that experimental results indicate severe grain boundary damage on thermal cycling. Using detailed microstructural information obtained through orientation imaging microscopy, the elaborated microstructural model reflects patterns of localized plastic strains and damage that show remarkable correlation with the experimentally found patterns. At the mesoscale, the numerical-experimental analysis concentrates at the internal and external interfaces in the material. A cohesive zone methodology is followed here, which represents the homogenized response of the underlying complex interfacial intermetallic microstructure. The motivation, qualification and quantification of the cohesive zone parameters are briefly addressed. The paper concludes by emphasizing the importance of collecting and exploiting different computational and experimental techniques in a multiscale setting, for which the case studied here constitutes a relevant example.

ЦИТИРОВАНО В
  1. Schmitz G.J., Zhou B., Böttger B., Klima S., Villain J., Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders, Journal of Electronic Materials, 42, 8, 2013. Crossref

  2. Heinemann Christian, Kraus Christiane, A degenerating Cahn–Hilliard system coupled with complete damage processes, Nonlinear Analysis: Real World Applications, 22, 2015. Crossref

  3. Heinemann Christian, Kraus Christiane, Complete damage in linear elastic materials: modeling, weak formulation and existence results, Calculus of Variations and Partial Differential Equations, 54, 1, 2015. Crossref

  4. Kraus Christiane, Bonetti Elena, Heinemann Christian, Segatti Antonio, Modeling and analysis of a phase field system for damage and phase separation processes in solids, Journal of Differential Equations, 258, 11, 2015. Crossref

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