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Портал Begell Электронная Бибилиотека e-Книги Журналы Справочники и Сборники статей Коллекции
International Journal for Multiscale Computational Engineering
Импакт фактор: 1.103 5-летний Импакт фактор: 0.943

ISSN Печать: 1543-1649
ISSN Онлайн: 1940-4352

Выпуски:
Том 16, 2018 Том 15, 2017 Том 14, 2016 Том 13, 2015 Том 12, 2014 Том 11, 2013 Том 10, 2012 Том 9, 2011 Том 8, 2010 Том 7, 2009 Том 6, 2008 Том 5, 2007 Том 4, 2006 Том 3, 2005 Том 2, 2004 Том 1, 2003

International Journal for Multiscale Computational Engineering

Купить выпуск $150.00 Том 10, 2012 Выпуск 1

DOI: 10.1615/IntJMultCompEng.v10.i1

Содержание:

MULTISCALE COMPUTATION AND MODELING OF DEFECTS IN MATERIALS
Vikram Gavini
vii pages
DOI: 10.1615/IntJMultCompEng.2011004496
THERMAL EXPANSION BEHAVIOR OF Al AND Ta USING AFINITE-TEMPERATURE EXTENSION OF THE QUASICONTINUUM METHOD
Gabriela Venturini, Jaime Marian, Jaroslaw Knap, G. Campbell, Michael Ortiz
pages 1-11
DOI: 10.1615/IntJMultCompEng.2011002122
COARSE GRAINING OF ATOMISTIC DESCRIPTION AT FINITE TEMPERATURE USING FORMAL ASYMPTOTICS
Yashashree Kulkarni
pages 13-31
DOI: 10.1615/IntJMultCompEng.2011002218
ANALYSIS OF THE QUASI-NONLOCAL QUASICONTINUUM APPROXIMATION OF THE EMBEDDED ATOM MODEL
Xingjie Helen Li, Mitchell Luskin
pages 33-49
DOI: 10.1615/IntJMultCompEng.2011002514
STRESS-BASED ATOMISTIC/CONTINUUM COUPLING: A NEW VARIANT OF THE QUASICONTINUUM APPROXIMATION
C. Makridakis, Christoph Ortner, E. Suli
pages 51-64
DOI: 10.1615/IntJMultCompEng.2011002388
RECENT DEVELOPMENT IN QUANTUM MECHANICS/MOLECULAR MECHANICS MODELING FOR MATERIALS
Xu Zhang, Yi Zhao, Gang Lu
pages 65-82
DOI: 10.1615/IntJMultCompEng.2011002139
LINEAR SCALING SOLUTION OF THE ALL-ELECTRON COULOMB PROBLEM INSOLIDS
J. E. Pask, N. Sukumar, S. E. Mousavi
pages 83-99
DOI: 10.1615/IntJMultCompEng.2011002201
SADDLE NODE SCALING ON APPROACH TO DISLOCATION NUCLEATION
Asad Hasan, Craig Maloney
pages 101-108
DOI: 10.1615/IntJMultCompEng.2011002554
DYNAMICS OF NANOSCALE VOID-FIBER ASSEMBLY FOR MATION INIRRADIATED AMORPHOUS MATERIALS
Kun-Dar Li, Qiangmin Wei, Lumin Wang, Wei Lu
pages 109-116
DOI: 10.1615/IntJMultCompEng.2011002152