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Портал Begell Электронная Бибилиотека e-Книги Журналы Справочники и Сборники статей Коллекции
International Journal for Multiscale Computational Engineering
Импакт фактор: 1.016 5-летний Импакт фактор: 1.194 SJR: 0.452 SNIP: 0.68 CiteScore™: 1.18

ISSN Печать: 1543-1649
ISSN Онлайн: 1940-4352

Выпуски:
Том 17, 2019 Том 16, 2018 Том 15, 2017 Том 14, 2016 Том 13, 2015 Том 12, 2014 Том 11, 2013 Том 10, 2012 Том 9, 2011 Том 8, 2010 Том 7, 2009 Том 6, 2008 Том 5, 2007 Том 4, 2006 Том 3, 2005 Том 2, 2004 Том 1, 2003

International Journal for Multiscale Computational Engineering

DOI: 10.1615/IntJMultCompEng.2014007937
pages 211-221

INVESTIGATION ON INTERFACIAL THERMAL RESISTANCES OF Al/Cu STRUCTURE BY USING HYBRID MODELING WITH MULTISCALE CHARACTERISTICS

Ping Yang
Laboratory of Span-Scale Design and Manufacturing, Jiangsu University, Zhenjiang, 212013, China
Yanfang Zhao
Laboratory of Span-Scale Design and Manufacturing, Jiangsu University, Zhenjiang, 212013, China
Liqiang Zhang
Laboratory of Span-Scale Design and Manufacturing, Jiangsu University, Zhenjiang, 212013, China
Yunqingn Tang
Laboratory of Span-Scale Design and Manufacturing, Jiangsu University, Zhenjiang, 212013, China
Haiying Yang
School of Materials Science and Engineering, Jiangsu University, Zhenjiang, 212013, China

Краткое описание

The size effects of interfacial thermal resistance (ITR), interfacial thermal conductivity (ITC), and interfacial region thickness (IRT) of the metal matching structure are investigated by presenting a multiscale method. In this multiscale method, the interface stress element (ISE) method is set as a coupling button to a span-scale model combined with molecular dynamics (MD) and finite element methods (FEM) by HMD−ISE and HISE−FE handshake regions. The Al/Cu structure simulation can illustrate the validity of this numerical evaluation method considering the wire bonding temperature (300~800 K). The simulation shows that the ITR nonlinear decreases with the increasing of bonding temperature, while the IRT nonlinear increases with the increase of bonding temperature. The ITC nonlinear increases with the increasing of bonding temperature. It indicates that the higher bonding temperature can improve the ITC and IRT of the interface structure. All these are useful for understanding the interfacial properties of wire bonding interface structures. It implies a potential method for design and analysis of the interfacial characteristics in micro-/nanoassembly.


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