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Портал Begell Электронная Бибилиотека e-Книги Журналы Справочники и Сборники статей Коллекции
International Journal for Multiscale Computational Engineering
Импакт фактор: 1.016 5-летний Импакт фактор: 1.194 SJR: 0.554 SNIP: 0.82 CiteScore™: 2

ISSN Печать: 1543-1649
ISSN Онлайн: 1940-4352

Выпуски:
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International Journal for Multiscale Computational Engineering

DOI: 10.1615/IntJMultCompEng.2017020317
pages 285-293

THE VOIDS FORMATION IN Ni–Cu ALLOYS

Bartek Wierzba
Rzeszow University of Technology, Faculty of Mechanical Engineering and Aeronautics, al. Powstanców Warszawy 12, 35-959 Rzeszow, Poland
Stanislaw Wedrychowicz
Rzeszow University of Technology, Faculty of Mathematics, al. Powstanców Warszawy 12, 35-959 Rzeszow, Poland
Wojciech Jerzy Nowak
Rzeszow University of Technology, Faculty of Mechanical Engineering and Aeronautics, al. Powstanców Warszawy 12, 35-959 Rzeszow, Poland
Patrycja Wierzba
Rzeszow University of Technology, Faculty of Mechanical Engineering and Aeronautics, al. Powstanców Warszawy 12, 35-959 Rzeszow, Poland
Zbigniew Grzesik
AGH - University of Science and Technology, Faculty of Materials Science and Ceramics, al. Mickiewicza 30, 30-059 Kraków, Poland

Краткое описание

In this paper a two-dimensional model of void formation during interdiffusion is discussed. The Kirkendall and Frenkel effects are also analyzed using numerical simulations. The Kirkendall phenomenon causes the lattice shift and the voiding. The generalized Darken method along with a numerical model will be introduced. The approximation method allows for determining the evolution of voids. The model will be experimentally checked using a Ni–Cu system. It will be presented, that the voids are formed at the Matano interface and then move during the process with parabolic velocity.

Ключевые слова: Kirkendall plane, voids, diffusion, mass conservation

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