Краткое описание

This paper proposes new correlations to predict the pool-boiling heat transfer coefficients on micropatterned silicon wafer surfaces. Two different approaches were followed in this study. The first approach consisted of developing a modified Rohsenow correlation, which includes a geometrical parameter that can accurately describe the topology of the surfaces. In the second approach, original correlations were devised based on a dimensional analysis. The independent data required for validation of the proposed relations were collected by coupling high-speed visualization and image postprocessing with heat flux/surface temperature measurements. Additional data were taken from the literature, for comparative purposes. The modified Rohsenow correlation was able to predict the pool-boiling heat transfer coefficients for all of the fluid/surface combinations tested (which were gathered with additional data reported in the literature) within an error of ±20%. The two correlations obtained by dimensional analysis were slightly different in terms of the phenomenological description of the boiling process. Both were able to predict the heat transfer coefficient within an error of ±30%. In addition, these correlations could predict the behavior of fluids with significantly different thermo-physical properties. The main difference between the relations proposed here is that, while the first correlation, based on Rohsenow's approach, can only partially capture the mechanisms involved in the pool-boiling process, the second approach provides a dimensional analysis based on the heat flux partitioning model widely known in literature, which seems to be more representative of the governing mechanisms.