%0 Journal Article
%A Rao, Sameer Raghavendra
%A Peles, Yoav
%D 2014
%I Begell House
%K boiling and evaporation, measurement and instrumentation, nano-/microscale measurement
and simulation, NEMS/MEMS, two-phase/multiphase flow
%N 4
%P 385-397
%R 10.1615/InterfacPhenomHeatTransfer.2015012351
%T DEVELOPMENT OF AN EXPERIMENTAL METHOD FOR FLOW-BOILING HEAT TRANSFER IN MICROCHANNELS
%U https://www.dl.begellhouse.com/journals/728e68e739b67efe,4ff6301660697494,57ec12d1610bfb7b.html
%V 2
%X In this paper, we report on an experimental method, supported by a numerical conduction model, to determine the fundamental mechanisms controlling flow-boiling heat transfer processes, such as during bubble ebullition. This is achieved by synchronizing high-speed visualization with surface temperature measurement and using the numerical model to infer the heat transfer coefficient from the surface temperature measurements. A slip coefficient, S, is defined and provides a quantitative measure of the effect of conduction heat transfer in typical flow-boiling experiments in microchannels.
To demonstrate the method, three high-speed experimental measurements are detailed. Surface temperatures at high
frequencies (O(10 kHz)) are obtained with micron-sized thermistors; boiling events are simultaneously visualized and used in conjunction with transient temperature measurements and the S coefficient to infer processes controlling heat transfer in a microchannel. The results demonstrate that microdomains formed by high-thermal-conductivity substrates, including silicon and copper, cannot be used to reveal transient processes at the microscale. Even results obtained using
low-thermal-conductivity materials such as Pyrex and Benzocyclobutene (BCB) require conduction numerical analysis in the solid structure to decouple the convection and conduction processes.
%8 2015-05-14