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EXPERIMENTAL AND NUMERICAL STUDY OF FLOW DEFLECTION EFFECTS ON ELECTRONIC AIR-COOLING

DOI: 10.1615/ICHMT.2009.CONV.270
20 pages

Ahlem Arfaoui
Laboratoire UTAP-Thermomécanique, Faculté des sciences, BP 1039, 51687 Reims, France; and Laboratoire d’Energétique et Transferts Thermique et Massique, Faculté des sciences, 2092 Manar II, Tunisie

Mourad Rebay
University of Reims Champagne-Ardenne GRESPI / Faculte des Sciences PB 1039, 51687 Reims, France

Rejeb Ben Maad
University Tunis El Manar, Faculty of Sciences of Tunis, Department of Physics, Laboratory of Energizing and Thermal and Mass Transfers, 2092 El Manar II, Tunis, Tunisia

Mahmoud Hammami
LETTM, Faculty of Sciences of Tunis, 2092 El Manar 2, Tunisia

Jacques Padet
Laboratoire de Thermomécanique - UTAP Moulin de la housse, Faculté des Sciences, Université de Reims Champagne Ardenne, B.P. 1039, 51687 Reims cedex 2, France

Аннотация

This work present a numerical and experimental investigation of the influence of transversal flow deflector on the cooling of a heated block mounted on a flat plate. The deflector is inclined and therefore it guides the air flow to the upper surface of the block. This situation is simulating the air-cooling of a rectangular integrated circuit or a current converter mounted on an electronic board. The electronic component are assumed dissipating a low or medium heat flux (with a density lower than 5000 W/m2), as such the forced convection air cooling without fan or heat sink is still sufficient. The study details the effects of the angle of deflector on the temperature and the heat transfer coefficient along the surface of the block and around it. The results of the numerical simulations and the InfraRed camera measurements show that the deviation caused by deflector may significantly enhance the heat transfer on the top face of block.

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