TRANSPORT PHENOMENA IN PRINTABLE ELECTRONICS
This review describes the transport processes in evaporation-driven self-assembly of colloidal drops containing functional materials for printable electronics fabrication. The jetting of solution-processed functional materials involves drop formation, impact, wetting, carrier liquid evaporation, and particle self-assembly and deposition, in which the interplay determines the final mechanical, thermal, and electrical properties of the deposited electronic materials. The capillary-driven, non-uniform deposition of functional materials challenges the quality of printable electronics that often require uniform patterns to achieve high performance. Several approaches have been introduced to suppress the coffee-ring effect. Numerical modeling to directly simulate particle–particle, particle–liquid, and particle–substrate interactions, and to predict final morphology of deposition patterns is discussed to better understand and control inkjet printing of colloidal drops for printable electronics fabrication.
ARHT Digital Library
Illustration of composite TIMs with a percolation of spherical nanoparticles, and high aspect ratio nanowires. NANOSTRUCTURED THERMAL INTERFACES
Photograph of copper/diamond sintered wick structure. RECENT ADVANCES IN TWO-PHASE THERMAL GROUND PLANES
The microchannel with a single pillar used by Jung et al., and an SEM image of the pillar with a flow control slit at 180 deg (facing downstream). ADVANCED CHIP-LEVEL LIQUID HEAT EXCHANGERS
Schematics of thermal boundary conductance calculations. NONEQUILIRIUM MOLECULAR DYNAMICS METHODS FOR LATTICE HEAT CONDUCTION CALCULATIONS
|Портал||Begell Электронная Бибилиотека||e-Книги||Журналы||Справочники и Сборники статей||Коллекции|