每年出版 18 期
ISSN 打印: 1064-2285
ISSN 在线: 2162-6561
IF:
1.7
5-Year IF:
1.4
Immediacy Index:
0.6
Eigenfactor:
0.00072
JCI:
0.43
SJR:
0.318
SNIP:
0.568
CiteScore™::
3.5
H-Index:
28
Indexed in
THERMAL-MECHANICAL COUPLING PROPAGATION AND TRANSIENT THERMAL FRACTURE IN MULTILAYER COATINGS
Get access
摘要
A definite solution problem of a coupled thermal-mechanical model is considered for in-plane double-layer coatings, subjected to a heat pulse. The general solution of the governing coupled equations is obtained using the dual-phase lag model of the non-Fourier heat conduction law. The temperature increment T and volumetric strain θ are derived, which are related to the logarithmic heat rate ε. A thermal-mechanical failure analysis of the coating system is made and the possible failure mode is also investigated. The results show that the wave front propagates along the interface because of the reflection and superposition at the convex part of the interface. Transient stress intensity factors of mode I are obtained in the double-layer system with cracks close to the interface. Moreover, the influences of different relaxation times and of the radius of the interface curvature are discussed.
-
Zhang Long, Zhang Xiaomin, Song Jiyun, Zheng Hengwei, Generalized thermoelastic analysis of thermo-optic switch multi-layer structure, Optik, 178, 2019. Crossref
-
Guo S.L., Wang B.L., Wang K.F., Dual-phase-lag heat conduction and associate fracture mechanics of a ceramic fiber/matrix composite cylinder, Ceramics International, 45, 4, 2019. Crossref
-
Guo S.L., Wang B.L., Li J.E., Surface thermal shock fracture and thermal crack growth behavior of thin plates based on dual-phase-lag heat conduction, Theoretical and Applied Fracture Mechanics, 96, 2018. Crossref
-
Guo S.L., Wang K.F., Wang B.L., Dual-phase-lagging heat conduction and associated thermal shock fracture of sandwich composite plates, International Journal of Heat and Mass Transfer, 139, 2019. Crossref
-
Zuo Haochen, Cao Shouqi, Yin Qingzhao, Huang Junjun, Investigation of alloying process of Cu and Au nanoparticles based on molecular dynamics simulation, International Journal of Modern Physics B, 34, 26, 2020. Crossref
-
Cao Jinchen, Li Leilei, Zhang Cheng, The coalescence of Cu nanoparticles with different interfacial lattice structures: A molecular dynamics study, Modern Physics Letters B, 35, 09, 2021. Crossref
-
Zuo Haochen, Cao Shouqi, Yin Qingzhao, Molecular dynamics study of alloying process of Cu–Au nanoparticles with different heating rates, International Journal of Modern Physics B, 35, 04, 2021. Crossref