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热管科学与技术

每年出版 4 

ISSN 打印: 2151-7975

ISSN 在线: 2151-7991

DEVELOPMENT OF ADVANCED MINIATURE COPPER HEAT PIPES FOR A COOLING SYSTEM OF A MOBILE PC PLATFORM

卷 1, 册 1, 2010, pp. 59-70
DOI: 10.1615/HeatPipeScieTech.v1.i1.40
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摘要

At present, miniature heat pipes are widely used for cooling systems of mobile PCs. This paper presents an overview of the development of miniature heat pipes (MHP) with a sintered copper wick with emphasis to different ways of heat pipe wick optimization. Several designs of cylindrical heat pipes with 4-, 5-, and 6-mm outer diameter and 200-mm length, which are the most attractive for the CPU cooling system, have been tailored, tested, and compared to theoretical values in this study to evaluate its thermal performances. A new design of 4- and 5-mm-outer diameter miniature copper heat pipes with innovative wicks is suggested as a promising candidate for present and future cooling systems of high-power mobile PC platforms.

对本文的引用
  1. Shewale Sapana P., Sahu S. K., Chougule Sandesh S., Pise A. T., A review of heat pipe with nanofluid for electronic cooling, 2014 International Conference on Advances in Engineering and Technology (ICAET), 2014. Crossref

  2. Nikolaenko Yu. E., Melnyk R. S., Rudenko A. I., Rotner S. M., Constructive and technological aspects of the heat flow imitator based on diamond-like films, Технология и конструирование в электронной аппаратуре, 6, 2017. Crossref

  3. Nikolaenko Yu.E., Pekur D.V., Sorokin V.M., Кravets V.Yu., Melnyk R.S., Lipnitskyi L.V., Solomakha A.S., Experimental study on characteristics of gravity heat pipe with threaded evaporator, Thermal Science and Engineering Progress, 26, 2021. Crossref

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