每年出版 4 期
ISSN 打印: 2151-7975
ISSN 在线: 2151-7991
UTILIZATION OF PASSIVE THERMAL CONTROL TECHNOLOGIES IN COOLING ELECTRONICS: A BRIEF REVIEW
摘要
The technologies that have been used for space missions have gained attention in several other applications, especially for military and surveillance systems. The increase in the processing speeds and needs for communications with high data rates have resulted in higher heat dissipation rates that require proper consideration. Depending on the project, severe limitations are presented in systems operating in ground missions, which require the use of technologies only considered before in satellites. Therefore, heat pipes and their related technologies, together with the enhancement promoted by the use of nanofluids as alternative working fluids, have gained attention and have been applied in several systems with reliable results. Such applications have allowed the design of more compact systems enhancing their capabilities of heat dissipation, keeping the systems' temperatures within the required limits established by the projects' requirements. From heat pipes applied on radars and military communication systems to loop heat pipes being considered for several other ground applications, the use of those technologies have opened new horizons for solutions of thermal issues. Since the heat dissipation rates have increased dramatically over the last years, nanofluids also require important consideration to be made before defining them as a contribution. Based on potential applications, the objective of this work is to present a brief review on passive thermal control systems technologies that can be applied to current ground systems, considering their potential contribution to the enhancement of heat dissipation rates but also pointing some of the limitations in applying them.
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