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Computational Thermal Sciences: An International Journal

Erscheint 6 Ausgaben pro Jahr

ISSN Druckformat: 1940-2503

ISSN Online: 1940-2554

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.5 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.3 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00017 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.28 SJR: 0.279 SNIP: 0.544 CiteScore™:: 2.5 H-Index: 22

Indexed in

THERMO-ELECTRICAL CO-DESIGN OF THREE-DIMENSIONAL INTEGRATED CIRCUITS: CHALLENGES AND OPPORTUNITIES

Volumen 5, Ausgabe 6, 2013, pp. 441-458
DOI: 10.1615/ComputThermalScien.2013007643
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ABSTRAKT

This paper focuses on the thermal challenges in three-dimensional (3D) chip stacking, which is poised to become the next packaging paradigm in the electronic industry. While this paradigm provides significant improvements in device density, interconnect delays, and system integration, it is expected to lead to higher heat densities along with decreased access of chip hot spots to air-cooled heat sinks. Excessive chip temperatures are a well-known culprit leading to performance and reliability loss as well as higher leakage power. This paper investigates the advantages and challenges imposed by interlayer microfluidic cooling to address the thermal needs of 3D integrated circuits (ICs). We present a brief review of the emerging 3D form factors and application of microfluidic cooling followed by several case studies that quantify the potential improvement obtained by co-design of the thermal and electrical aspects of the 3D ICs. We underscore the need for better unification of the thermal and fluidic aspects of the system into an integrated co-design environment that enables designers to estimate the impact of the cooling solutions on the electrical aspects and vice versa. Such a co-design approach would be imperative for unlocking the high performance and energy efficiency of 3D ICs.

REFERENZIERT VON
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