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Interfacial Phenomena and Heat Transfer

Erscheint 4 Ausgaben pro Jahr

ISSN Druckformat: 2169-2785

ISSN Online: 2167-857X

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 0.5 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 0.8 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.2 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00018 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.11 SJR: 0.286 SNIP: 1.032 CiteScore™:: 1.6 H-Index: 10

Indexed in

COMBINED EFFECT OF SUBSTRATE WETTABILITY AND THERMAL PROPERTIES ON EVAPORATION DYNAMICS OF A SESSILE DROPLET

Volumen 5, Ausgabe 4, 2017, pp. 321-335
DOI: 10.1615/InterfacPhenomHeatTransfer.2018021373
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ABSTRAKT

The prediction and manipulation of sessile droplet evaporation is an important problem with applications such as in microfluidics, printing, and microfabrication. The simple vapor diffusion model is frequently used to model droplet evaporation for the prediction of interfacial evaporation rates and evaporative flux, under the premise that vapor mass diffusion is the only physical transport mechanism responsible for droplet evaporation. However, droplet evaporation is known to be governed by additional transport mechanisms. Two of these are evaporative cooling at the air-liquid interface and heat conduction in the solid-liquid-gas domain. Furthermore, sessile droplet evaporation is also limited by the substrates' characteristics, specifically thermal properties and surface wettability. Hence, an extended vapor diffusion model has been built in COMSOL that incorporates the additional transport mechanisms and predicts evaporation rates, interfacial evaporative flux, and temperature distribution around the sessile droplet. This model has first been validated against controlled laboratory experiments for sessile droplet evaporation of water on copper and glass substrates, with distinct wettability. Subsequently, the model is used to discern the combined effect of substrate thermal properties and wettability on the evaporation dynamics of a sessile droplet. Results show that droplet evaporation on a highly hydrophobic or low thermal conductivity substrate is accompanied by significant lowering of temperature at the liquid-gas interface. This limits the capability of a simple vapor diffusion model to correctly predict droplet evaporation rates for such substrates. The extended vapor diffusion model, however, takes interfacial evaporative cooling and substrate properties into account and correctly predicts the ensuing evaporation rates. Specifically, when a sessile droplet evaporates on a low wettability and low thermal conductivity substrate, their combined effect causes a large drop in its evaporation rates, relative to what is estimated using a pure vapor diffusion model.

REFERENZIERT VON
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  2. Nahar Mun Mun, Ma Binjian, Guye Kidus, Chau Quan H., Padilla Jorge, Iyengar Madhusudan, Agonafer Damena, Review article: Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances, Applied Thermal Engineering, 194, 2021. Crossref

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