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Interfacial Phenomena and Heat Transfer

Published 4 issues per year

ISSN Print: 2169-2785

ISSN Online: 2167-857X

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 0.5 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 0.8 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.2 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00018 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.11 SJR: 0.286 SNIP: 1.032 CiteScore™:: 1.6 H-Index: 10

Indexed in

ENHANCED HEAT TRANSFER OF FLOW BOILING COMBINED WITH JET IMPINGEMENT

Volume 1, Issue 1, 2013, pp. 13-28
DOI: 10.1615/InterfacPhenomHeatTransfer.2013006382
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ABSTRACT

The experiment was made at flow boiling heat transfer of FC-72 on micro-pin-finned chips with jet impingement. The experimental conditions cover two different liquid subcooling degrees (25, 35 K), three different crossflow velocities (Vc = 0.5, 1, 1.5 m/s), and three different jet velocities (Vj = 0, 1, 2 m/s) in the direction perpendicular to chip surface. The dimension of the silicon chips is 10 mm × 10 mm × 0.5 mm (length × width × thickness) on which four kinds of micro-pin-fins with the dimensions of 30 × 30 × 60 μm3, 50 × 50 × 60 μm3, 30 × 30 × 120 μm3, 50 × 50 × 120 μm3 (width × thickness × height, named PF30-60, PF50-60, PF30-120, PF50-120) were fabricated using the dry etching technique. A smooth surface (named chip S) was also tested for comparison. The results have shown that flow boiling combined with jet impingement gives a large heat transfer enhancement compared with pool boiling and flow boiling. It has been also found that micro-pin-finned surfaces enhance heat transfer compared with the smooth surface. For all chips, the maximum q CHF increases in the order of chips S, PF50-60, PF30-60, PF50-120, PF30-120, and q CHF increases with crossflow or jet velocities. The maximum allowable heat flux q max is given by the q CHF if Tw,CHF < 85°C and by q at Tw = 85°C, if Tw,CHF > 85°C. Effects of liquid subcooling, surface structure, and boiling heat transfer mode on maximum allowable heat flux were also investigated in the present experiment, and the combination of these influence factors of maximum allowable heat flux exerts a synergistic effect. The maximum allowable heat flux of chip S is 15.1 W/cm2 at ΔTsub = 25 K by pool boiling, and the maximum allowable heat flux of micro-pin-fins by crossflow–jet combined boiling in the experiment is 167 W/cm2, which is 11.06 times as large as that for the smooth surface without additional flow.

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