Publicado 8 números por año
ISSN Imprimir: 1065-5131
ISSN En Línea: 1563-5074
Indexed in
Thermal Performance of a Compact Two-phase Thermosyphon: Response to Evaporator Confinement and Transient Loads
SINOPSIS
This study investigates the effect of evaporator confinement on the performance of an enhanced microstructure based thermosyphon, that has shown very high heat transfer rates (upto 100 W/cm2). The enhanced structure used demonstrates almost 2.5 times increase in the heat transfer compared to a solid block of the same size. The top spacing between the microstructure and the cover of the evaporator was varied and its effect on heat transfer was studied. The results for the effect of sidewall spacing show that the influence of confinement on the boiling performance of the microstructure is negligible. Total blockage does deteriorate the performance at very high heat fluxes (40−70 W/cm2). However, a minute gap of the order 1.5−3 mm is sufficient to get to performance levels close to boiling in a large enclosure. The response of the confined setup was then studied under suddenly applied loads. This is of particular importance to practical applications where a sudden temperature excursion could be detrimental to electronics. The results show a very smooth transition from startup to steady state. No incipience excursion was observed in any of the runs.
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Ghiu Camil-Daniel, Joshi Yogendra K., Pool Boiling Using Thin Enhanced Structures Under Top-Confined Conditions, Journal of Heat Transfer, 128, 12, 2006. Crossref
-
Ramaswamy C., Joshi Y.K., Nakayama W., Johnson W.B., Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon, IEEE Transactions on Components and Packaging Technologies, 23, 1, 2000. Crossref
-
Lim Kyungbin, Roh Hongkoo, Thermal characteristics of graphite foam thermosyphon for electronics cooling, Journal of Mechanical Science and Technology, 19, 10, 2005. Crossref
-
Pal Aniruddha, Joshi Yogendra, Boiling of Water at Subatmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume, Journal of Electronic Packaging, 130, 1, 2008. Crossref
-
Tang Yong, Lu Long-sheng, Yuan Dong, Su Da-shi, Micro-column enhanced boiling structure and its ramification, Journal of Central South University of Technology, 15, S2, 2008. Crossref
-
HONDA Hiroshi, WEI JinJia, Advances in Enhanced Boiling Heat Transfer From Electronic Components, JSME International Journal Series B, 46, 4, 2003. Crossref
-
Pal A., Joshi Y.K., Beitelmal M.H., Patel C.D., Wenger T.M., Design and performance evaluation of a compact thermosyphon, IEEE Transactions on Components and Packaging Technologies, 25, 4, 2002. Crossref
-
Coursey Johnathan S., Kim Jungho, Boudreaux Paul J., Performance of Graphite Foam Evaporator for Use in Thermal Management, Journal of Electronic Packaging, 127, 2, 2005. Crossref
-
Pal Aniruddha, Joshi Yogendra, Boiling at Subatmospheric Pressures with Enhanced Structures, Journal of Thermophysics and Heat Transfer, 23, 1, 2009. Crossref
-
Goldstein R.J., Eckert E.R.G., Ibele W.E., Patankar S.V., Simon T.W., Kuehn T.H., Strykowski P.J., Tamma K.K., Bar-Cohen A., Heberlein J.V.R., Davidson J.H., Bischof J., Kulacki F.A., Kortshagen U., Garrick S., Heat transfer – a review of 1999 literature, International Journal of Heat and Mass Transfer, 44, 19, 2001. Crossref
-
Samba Ahmadou, Louahlia-Gualous Hasna, Le Masson Stéphane, Nörterhäuser David, Two-phase thermosyphon loop for cooling outdoor telecommunication equipments, Applied Thermal Engineering, 50, 1, 2013. Crossref
-
Peng Hao, Ling Xiang, Li Juan, Numerical simulation and experimental verification on thermal performance of a novel fin-plate thermosyphon, Applied Thermal Engineering, 40, 2012. Crossref
-
Pal A., Joshi Y., Boiling at sub-atmospheric conditions with enhanced structures, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006., 2006. Crossref
-
CHI Yong, TANG Yong, CHEN Jin-chang, DENG Xue-xiong, LIU Lin, WAN Zhen-ping, LIU Xiao-qing, Forming process of cross-connected finned micro-grooves in copper strips, Transactions of Nonferrous Metals Society of China, 17, 2, 2007. Crossref
-
Tsai Te-En, Wu Hsin-Hsuan, Chang Chih-Chung, Chen Sih-Li, Two-phase closed thermosyphon vapor-chamber system for electronic cooling, International Communications in Heat and Mass Transfer, 37, 5, 2010. Crossref
-
Wang Rong-Tsu, Wang Jung-Chang, Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system, International Communications in Heat and Mass Transfer, 39, 3, 2012. Crossref
-
Farsi Hichem, Joly Jean-Louis, Miscevic Marc, Platel Vincent, Mazet Nathalie, An experimental and theoretical investigation of the transient behavior of a two-phase closed thermosyphon, Applied Thermal Engineering, 23, 15, 2003. Crossref
-
Pal Aniruddha, Joshi Yogendra, Boiling of Water at Sub-Atmospheric Conditions With Enhanced Structures: Effect of Liquid Fill Volume, Heat Transfer, Volume 2, 2006. Crossref
-
Wei J.J., Honda H., Effects of fin geometry on boiling heat transfer from silicon chips with micro-pin-fins immersed in FC-72, International Journal of Heat and Mass Transfer, 46, 21, 2003. Crossref