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Heat Transfer Research

Publication de 18  numéros par an

ISSN Imprimer: 1064-2285

ISSN En ligne: 2162-6561

The Impact Factor measures the average number of citations received in a particular year by papers published in the journal during the two preceding years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) IF: 1.7 To calculate the five year Impact Factor, citations are counted in 2017 to the previous five years and divided by the source items published in the previous five years. 2017 Journal Citation Reports (Clarivate Analytics, 2018) 5-Year IF: 1.4 The Immediacy Index is the average number of times an article is cited in the year it is published. The journal Immediacy Index indicates how quickly articles in a journal are cited. Immediacy Index: 0.6 The Eigenfactor score, developed by Jevin West and Carl Bergstrom at the University of Washington, is a rating of the total importance of a scientific journal. Journals are rated according to the number of incoming citations, with citations from highly ranked journals weighted to make a larger contribution to the eigenfactor than those from poorly ranked journals. Eigenfactor: 0.00072 The Journal Citation Indicator (JCI) is a single measurement of the field-normalized citation impact of journals in the Web of Science Core Collection across disciplines. The key words here are that the metric is normalized and cross-disciplinary. JCI: 0.43 SJR: 0.318 SNIP: 0.568 CiteScore™:: 3.5 H-Index: 28

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DESIGN OF A COOLING SYSTEM FOR MICROCHIPS WITH HIGH HEAT-FLUX DENSITY USING INTEGRATED MICROCHANNELS

Volume 48, Numéro 14, 2017, pp. 1299-1312
DOI: 10.1615/HeatTransRes.2017017180
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RÉSUMÉ

With the improvement of the integration technology, the heat-flux density in microchips has reached 1 kW/cm2. Traditional cooling methods cannot control the temperature below 393 K as desired. Thus chip cooling has become the bottleneck for further integration. To ensure a normal working condition, this paper proposed to use a microfluid to discharge the internal heat, by making the fluid flow through the integrated microchannels in a chip. To realize this, the present work firstly focused on the design of the microchannels based on a desired model of a microchip. Secondly, to find the optimized size of the microchannels, numerical simulation was performed. It was found that the diameter of the microchannels at 40 mm could keep the chip temperature around 393 K. Further experiments have been performed to verify the numerical results. Both the numerical and experimental results have shown that the highest temperature of a chip can be controlled to as low as 370 K through combining and adjusting the bidirectional flow, entering velocity, and entering temperature. These results proved the feasibility of the chip cooling concept using microchannels.

CITÉ PAR
  1. Widgington Joseph, Ivanov Atanas, Karayiannis Tassos, Review on Flow Boiling Patterns in Microchannels, 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 2022. Crossref

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