Published 4 issues per year
ISSN Print: 2169-2785
ISSN Online: 2167-857X
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INVESTIGATION OF WETTING BEHAVIOR ON PATTERNED SURFACES WITH DIFFERENT MICROGEOMETRIES
ABSTRACT
Recent rapid improvements of micro/nanofabrication techniques have allowed us to prepare patterned surfaces with controlled topographic structures. In this report, three kinds of patterned surfaces, i.e., square, triangle and circle post array surfaces have been prepared on silicon wafers. On such surfaces, for the same roughness or solid-liquid contact fraction value, different surface textures can exhibit completely different wetting behaviors. Effects of various microgeometrical parameters, such as microgeometrical scale effect, edge/corner pinning effect, geometrical shape effect, directiondependent effect, etc., on wetting have been investigated. For the patterned surfaces with fixed solid area fraction, a smaller microgeometrical scale can induce a larger receding contact angle, when it is compared to a larger microgeometrical scale. Competing factors such as solid area fraction and solid linear fraction are found to be responsible for such effect. Moreover, it is also revealed that there is a strong dependence of directions for surface wettability on the patterned surfaces. Different edge/corner pinning effects, including the pinning length and pinning point density, in various directions are suggested to be taken into consideration for affecting the surface wetting behavior.
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