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Journal of Enhanced Heat Transfer
Founding Advisory Editor: Arthur E. Bergles (open in a new tab)

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ISSN Imprimir: 1065-5131

ISSN On-line: 1563-5074

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IMPACT OF IMMERSION COOLING ON THERMOMECHANICAL PROPERTIES OF LOW-LOSS MATERIAL PRINTED CIRCUIT BOARDS

Volume 28, Edição 7, 2021, pp. 73-90
DOI: 10.1615/JEnhHeatTransf.2021039486
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Tushar Chauhan
Mechanical and Aerospace Engineering Department, University of Texas at Arlington, Arlington, TX, USA
Rabin Bhandari
Mechanical and Aerospace Engineering Department, University of Texas at Arlington, Arlington, TX, USA
Krishna Bhavana Sivaraju
Mechanical and Aerospace Engineering Department, University of Texas at Arlington, Arlington, TX, USA
A. S. M. Raufur Chowdhury
Mechanical and Aerospace Engineering Department, University of Texas at Arlington, Arlington, TX, USA
Dereje Agonafer
Mechanical and Aerospace Engineering Department, The University of Texas at Arlington, 500 W 1st St., Arlington, Texas 76019, USA

RESUMO

For traditional data centers, one-third of the total energy consumed is directed toward cooling information technology equipment. High demand for new data centers, vast amount of energy consumption, and their impact on the climate requires the data center industry to make them energy efficient and opt for immersion cooling technologies. From a thermal energy management perspective, immersion cooling is better than traditional air-cooling technology. However, detailed study of material compatibility of the various electronics packaging materials for immersion cooling is essential to understand their failure modes and reliability. The stiffness and thermal expansion are critical material properties for the mechanical design of electronics. Printed circuit board/substrate is a critical component of electronic package and heavily influences failure mechanism and reliability of electronics both at the package and board level. This study mainly focuses on two major challenges. The first part of the study focuses on the impact of thermal aging in dielectric fluid for single-phase immersion cooling on the low-loss material printed circuit board's (PCB's) thermomechanical properties. The PCB sample weight is compared to quantify absorption of the dielectric fluid into PCBs or leaching of the plasticizers into the fluid. The second part of the study is the impact of thermal aging on thermomechanical properties of low-loss PCBs in the air. The low-loss PCBs, Megtron6 are aged in mineral oil, and air for 720 hr at four different temperatures: 22, 50, 75, and 105° C. The complex modulus and coefficient of thermal expansion are characterized before and after aging for both parts and compared.

Palavras-chave: CTE, complex modulus, TMA, DMA, Megtron, low-loss PCB, immersion cooling
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CITADO POR

  1. Pambudi Nugroho Agung, Sarifudin Alfan, Firdaus Ridho Alfan, Ulfa Desita Kamila, Gandidi Indra Mamad, Romadhon Rahmat, The immersion cooling technology: Current and future development in energy saving, Alexandria Engineering Journal, 61, 12, 2022. Crossref

  2. Cheng Lixin, Chai Lei, Guo Zhixiong, THERMAL ENERGY, PROCESS, AND TRANSPORT INTENSIFICATION - A BRIEF REVIEW OF LITERATURE IN 2021 AND PROSPECTS , Heat Transfer Research, 53, 18, 2022. Crossref

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