DOI: 10.1615/ICHMT.2015.THMT-15
ISBN Print: 978-1-56700-427-4
ISBN CD: 978-1-56700-428-8
Heat transfer evaluation of bio-based shape stabilized PCM with boron nitride for enhancing thermal efficiency
RESUMO
Among the PCMs, Bio-based PCMs are considered one of the most promising candidates, due to their large latent heat, low vapor pressure in the melt, good chemical stability, self-nucleating behavior, safety, and commercial availability at lo w cost. However, the leakage problem and low thermal conductivity of Bio-based PCM limit its application, to so me extent. Therefore, porous materials with a high thermal conductivity, such as boron nitride, are promising candidates for simultaneously solving these two problems. In this study, we prepared Bio-based PCM with boron nitride, by using the vacuum impregnation process. We analyzed the microstructure, chemical bonding, heat capacity, thermal resistance and Thermal conductivity of Bio-based PCM with boron nitride, by FTIR, DSC, TGA and TCi analyses.